doc. no : qw0905-lhrf9ug 23092/p1 rev. : a date : 17 - jan - 2005 data sheet dual color led lamps lhrf9ug23092/p1 ligitek electronics co.,ltd. property of ligitek only
-60 x 60 x 100% 75% 100% 25% 0 50% 25% 75% 50% directivity radiation -30 x 0 x 30 x note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. page 1/5 part no. lhrf9ug23092/p1 package dimensions ligitek electronics co.,ltd. property of ligitek only 18.0min 14.7 ? 0.5 8.7 6.0 6.0 1.anode green 2.common cathode 3.anode red hrf 9ug 3 1 2 3 2.0min 2.0min ?? 0.5 typ 1.5 max 2 1 2.54typ 2.54typ
white diffused note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. green algainp 574 120 20 1.7 50 2.6 34 dominant wave length f dnm color emitted red lhrf9ug23092/p1 algainp part no material 630 lens luminous intensity @20ma(mcd) viewing angle 2 c 1/2 (deg) forward voltage @20ma(v) spectral halfwidth ??f nm 350 typ. min. min. 20 1.5 2.4 220 max. 34 typical electrical & optical characteristics (ta=25 j ) soldering temperature storage temperature tsol tstg max 260 j for 5 sec max (2mm from body) -40 ~ +100 j 90 75 ir reverse current @5v electrostatic discharge operating temperature t opr esd power dissipation peak forward current duty 1/10@10khz pd i fp g a 10 -40 ~ +85 2000 j v 75 60 mw ma hrf 30 absolute maximum ratings at ta=25 j forward current parameter i f symbol ratings 9ug 30 ma unit ligitek electronics co.,ltd. property of ligitek only part no. lhrf9ug23092/p1 page 2/5
1.0 forward voltage@20ma normalize @25 j relative intensity@20ma normalize@25 j ambient temperature( j ) ambient temperature( j ) fig.5 relative intensity vs. wavelength -40 0.8 0.9 -20 -0 20 40 0.5 100 80 60 0 0 -20 -40 20 40 100 60 80 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current 100 forward current(ma) fig.4 relative intensity vs. temperature 3.0 forward current(ma) forward voltage(v) fig.3 forward voltage vs. temperature 1.0 1.1 1.2 1.0 1.0 0.1 10 100 1.5 2.0 3.0 2.0 1.5 2.5 2.5 2.0 1.5 1.0 0.5 0 relative intensity normalize @20ma 2.5 3.0 10 1.0 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage hrf chip 1000 3.5 1000 650 700 550 600 wavelength (nm) 1.0 0.5 relative intensity@20ma 0 page 3/5 part no. lhrf9ug23092/p1
fig.3 forward voltage vs. temperature ambient temperature( j ) forward voltage@20ma normaliz @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity @20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0 0.5 2.0 3.0 4.0 5.0 0.8 40 -20 -40 80 100 60 0 0.5 1.0 1.5 2.0 0.9 1.2 1.0 1.1 1.0 1.5 2.0 2.5 2.5 3.0 20 0 20 -40 0 -20 80 40 60 100 3.0 9ug chip fig.6 directive radiation wavelength (nm) relative intensity @20ma 0 500 0.5 1.0 550 600 650 fig.5 relative intensity vs. wavelength part no. lhrf9ug23092/p1 page 4/5
mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to see soldering well performed or not. 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles thermal shock test solder resistance test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. part no. lhrf9ug23092/p1 page 5/5 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) low temperature storage test operating life test high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition test item reliability test: description jis c 7021: b-12 reference standard ligitek electronics co.,ltd. property of ligitek only
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